Infineon Technologies 650V Automotive GaN Transistors - Bottom Cooled

Infineon Technologies 650V Automotive GaN Transistors - Bottom Cooled allows for high current, voltage breakdown, and switching frequency. Infineon Technologies transistors innovate with patented Island Technology® and GaNPX® packaging. Island Technology cell layout realizes high current die and high yield. GaNPX packaging enables low inductance and low thermal resistance in a small package. The GS-065-060-5-B-A is a bottom-side cooled transistor that offers low junction-to-case thermal resistance for demanding high-power applications. These features combine to provide high-efficiency power switching.

Features

  • AEC-Q101 and AutoQual+™ (enhanced AEC-Q101)
  • 650V enhancement mode power transistor
  • Bottom-cooled, low inductance GaNPX package
  • RDS(on) = 25mΩ
  • IDS(max) = 60A
  • Ultra-low FOM
  • Simple gate drive requirements (0V to 6V)
  • Transient tolerant gate drive (-20/+10V)
  • High switching frequency (>10MHz)
  • Fast and controllable fall and rise times
  • Reverse conduction capability
  • Zero reverse recovery loss
  • Small 11mm2 x 9mm2 PCB footprint
  • Dual gate pads for optimal board layout
  • RoHS 3 (6+4) compliant

Applications

  • On board chargers
  • Traction drive
  • DC-DC converters
  • Industrial motor drives
  • Solar inverters
  • Bridgeless totem pole PFC

Package & Circuit

Application Circuit Diagram - Infineon Technologies 650V Automotive GaN Transistors - Bottom Cooled
Publicado: 2023-03-06 | Actualizado: 2024-08-22