Texas Instruments Synchronous Buck NexFET™ Smart Power Stage
Texas Instruments Synchronous Buck NexFET™ Smart Power Stage in an Industry Standard Footprint has a highly optimized design for operating in a high-power, high-density synchronous buck converter. In completing the power stage switching function, the device integrates the driver IC and power MOSFETs.
These characteristics achieve high-current, high-efficiency, and high-speed switching capability in a small outline package. To improve accuracy and simplify system design, the TI Buck NexFET™ Smart Power Stage integrates accurate current and temperature sensing functionality. Completing the overall system design is facilitated, and design time is reduced by optimizing the PCB footprint.
Features
- High-frequency operation (up to 1.25MHz)
- Diode emulation function
- Temperature compensated bi-directional current sense
- Analog temperature output
- Fault monitoring
- 3.3V and 5V PWM signal compatible
- Tri-state PWM input
- Integrated bootstrap switch
- Optimized dead time for shoot-through protection
- Ultra-low-inductance package
- System optimized PCB footprint
- Thermally enhanced topside cooling
- RoHS compliant – lead-free terminal plating
- Halogen free
Associated Eval Module
Texas Instruments TPS536C7EVM-051 Evaluation Module
Configured to evaluate the operation of the TPS536C7 Controller.
Publicado: 2017-11-07
| Actualizado: 2022-07-11