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Texas Instruments AM273x/AM273x-Q1 Arm™-Based Microcontrollers

Texas Instruments AM273x/AM273x-Q1 Atm™-Based Microcontrollers are a highly-integrated, high-performance microcontroller based on the Arm® Cortex®-R5F and a C66x floating-point DSP cores. The device enables Original-Equipment Manufacturers (OEM) and Original-Design Manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance through the maximum flexibility of a fully integrated, mixed processor solution.

With an integrated Hardware Security Module (HSM) and functional safety support built-in, large, integrated RAM on a die, and a wide temperature range, the AM273x/AM273x-Q1 offers a safe, secure, and cost-effective solution for many industrial and automotive applications. The Texas Instruments AM273x/AM273x-Q1 device is provided as part of a complete platform solution, including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation. The AM273x-Q1 devices are AEC-Q100 qualified for automotive applications.

Features

  • Processor cores
    • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly integrated for real-time processing
      • Dual-core Arm Cortex-R5F cluster supports dual-core and single-core operation
      • 32KB ICache and 32KB DCache per R5F core with SECDED ECC on all memories
      • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
      • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
    • TMS320C66x DSP core
      • Single-core, 32-bit, floating-point DSP
      • Operating at 450MHz (14.4 GMAC)
  • Memory subsystem
    • Up to 5.0MB on-chip RAM (OCSRAM)
      • Memory space sharable between DSP, MCU, and shared L3
      • 3.5625MB shared L3 memory
      • 960KB dedicated to the main subsystem
      • 384KB dedicated to DSP subsystem
    • External Memory Interfaces (EMIF)
      • QSPI interface operating up to 67MHz
  • System on Chip (SoC) services and architecture
    • 12x EDMA for various subsystems, MCU, DSP, and accelerator cores
    • 5x Real-Time Interrupt (RTI) modules
    • Mailbox system for Interprocessor Communication (IPC)
    • JTAG/trace interfaces for device debugging
    • Clock source
      • 40.0MHz crystal with internal oscillator
      • Supports external oscillator at 40/50MHz
      • Supports externally driven clock (square/sine) at 40/50MHz
  • High-speed serial interfaces
    • 10/100Mbps Ethernet (RGMII/RMII/MII)
    • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
    • Output: 4-lane Aurora/LVDS
  • General connectivity peripherals
    • General Purpose Analog to Digital Converters (GPADC)
      • 1x 9-channel ADC supporting up to 625Ksps
    • Digital connectivity
      • 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
      • 3x Inter-Integrated Circuit (I2C) ports
      • 4x Universal Asynchronous Receiver-Transmitters (UART)
  • Industrial and control interfaces
    • 3x Enhanced Pulse-Width Modulator (ePWM)
    • 1x Enhanced Capture Module (eCAP)
    • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support
  • Power management
    • Simplified power sequencing and reduced number of power supply rails
    • Dual voltage digital I/O supporting 3.3V and 1.8V operation
  • Security
    • Device Security
      • Programmable embedded Hardware Security Module (HSM)
      • Secure authenticated and encrypted boot support
      • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
      • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG
  • Functional safety
    • Functional safety-compliant targeted
      • Developed for functional safety applications
      • Documentation will be available to aid ISO 26262 functional safety system design
      • Hardware integrity up to ASIL B targeted
      • Safety-related certification
        • ISO 26262 certification by TÜV SÜD planned
    • AEC-Q100 qualification targeted
    • Operating Conditions
      • Automotive-grade temperature range supported
      • Industrial grade temperature range supported
  • Package options
    • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
    • 45nm technology
    • Compact solution size

Applications

  • Robotics
  • Factory automation safety guards
  • Building automation
  • Automotive audio
  • Traffic monitoring
  • Machine vision
  • Avionics
  • Industrial transport

Additional Resources

Functional Block Diagram

Texas Instruments AM273x/AM273x-Q1 Arm™-Based Microcontrollers

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Publicado: 2022-03-01 | Actualizado: 2024-04-17