Infineon Technologies EDT3 Si IGBT Chips

Infineon Technologies Electric Drive Train, 3rd Gen. (EDT3) Si IGBT Chips feature 750V and 1200V classes and deliver high output current, making them ideal for main inverter applications in electric vehicles (EVs), including plug-in hybrid EVs (PHEVs), battery EV (BEVs), and range-extended EVs (REEVs). The next generation EDT3 provides a notable advancement over the EDT2, reaching up to 20% lower total losses at high loads while remaining efficient at low loads. This advancement is due to optimizations that diminish chip losses and boost the maximum junction temperature to +185°C, balancing low-load efficiency and high-load performance. EVs using Infineon EDT3 chips achieve an extended range and lowered energy consumption, delivering a more sustainable and cost-effective driving experience. These bare dies are designed for 400V and 800V systems.