Digi XBee® Wi-SUN® Modules - Coming Soon
Digi XBee® Wi-SUN® Modules are designed to enable long-range, low-power wireless communication for industrial and smart city applications. Built on the Wi-SUN (Wireless Smart Utility Network) standard, these Digi modules support secure, scalable, and interoperable mesh networking, making them ideal for smart metering, street lighting, and infrastructure monitoring. The modules offer robust performance in outdoor environments and are optimized for low latency and high reliability, even in dense urban deployments. With Digi’s comprehensive ecosystem (including development tools, gateways, and cloud integration), users can accelerate deployment and simplify management of large-scale wireless networks.Features
- Built on the Silicon Labs EFR32FG2x SoCs with Secure Vault™
- Full Function Node (FFN) and Leaf Node (LFN) modules to provide cost and performance-optimized options
- Support for FSK data rates from 30Kbps up to 500Kbps (LFN/FFN) and OFDM data rates from 12Kbps up to 2.4Mbps (FFN)
- Leaf Node supports battery-powered applications with up to 10 to 15 years of battery life
- Leaf Node with BLUETOOTH® LE for optional provisioning and sensor connectivity capabilities
- Up to 16dBm transmit power for FFN nodes, up to 20dBm transmit power for Leaf nodes
- On-module edge intelligence and local control with custom MicroPython applications
- Local interface support for GPIO, I2C, SPI, and UART
- Pre-injected certificates for simplified PKI deployment and management using Wi-SUN Alliance-approved Root CA
- -40°C to +85°C industrial operating temperature range
- Simplified global deployment with regulatory approvals for the US, Canada, Europe, India, and Japan
- Cisco OpenCSMP support for seamless integration into existing field network management infrastructures
- Wi-SUN CERTIFIED™ for proven FAN 1.1 standard compatibility with the broader Wi-SUN ecosystem
Applications
- Smart meters
- Public infrastructures
- Renewable energy
- Industrial
Publicado: 2025-07-08
| Actualizado: 2025-07-09
