Advanced Thermal Solutions Pin Fin Value-Line Heat Sinks
Advanced Thermal Solutions Pin Fin Value-Line Heat Sinks are engineered with thin and dense fields of pin-shaped cooling fins. These heat sinks are fabricated from extruded aluminum to minimize thermal resistance from the base to the fins. This process reduces weight and keeps the cost low. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm, and height ranges from 2mm to 25mm with 1mm increments. The pin fin heat sinks feature large surface areas that increase heat sink performance and provide high-efficiency and low-pressure drop characteristics. These heat sinks can be attached to the devices with double-sided thermal adhesive, Z-clip, or maxiGRIP™ technologies. The custom pin fin design offers an excellent cooling solution for spatially constrained PCB layouts when the airflow direction near the device is ambiguous.
Features
- High-efficiency pin fin design provides low-pressure drop characteristics
- Large surface area increases heat sink performance
- Comes standard without interface material or with most common pressure-sensitive thermal tapes as a custom option
- Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight, and keeps costs low
- Can be attached to the device with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies
Dimensions
Associated Heat Sinks
Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks
High-performance heat sinks are offered in pin fin, straight fin, and slant fin profiles.