ESD Protection Interface - Specialized

Results: 14
Select Image Part # Mfr. Description Datasheet Availability Pricing (PEN) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Protocol Supported Supply Voltage - Max Supply Voltage - Min Operating Supply Current Minimum Operating Temperature Maximum Operating Temperature Mounting Style Package / Case ESD Protection
Texas Instruments Interface - Specialized AISG 3.0 on and off keying coax modem t 11,079In Stock
Min.: 1
Mult.: 1
: 3,000

On and Off Keying Coax Modem Transceiver ASIG V2.0, ASIG V3.0 5.5 V 3 V 28 mA - 40 C + 120 C SMD/SMT VQFN-16 ESD Protection

NXP Semiconductors Interface - Specialized Isolated network high speed transceiver. 1,029In Stock
Min.: 1
Mult.: 1
: 2,500

Transform Physical Layer 7 V 4.5 V 40 mA - 40 C + 125 C SMD/SMT SOIC-16 ESD Protection

NXP Semiconductors Interface - Specialized Isolated network high speed transceiver. 1,301In Stock
Min.: 1
Mult.: 1

Transform Physical Layer 7 V 4.5 V 40 mA - 40 C + 125 C SMD/SMT SOIC-16 ESD Protection
NXP Semiconductors Interface - Specialized FlexRay node transceiver 1,548In Stock
Min.: 1
Mult.: 1
: 2,000

FlexRay Node Transceiver 5.25 V 4.75 V 37 mA SMD/SMT SSOP-16 ESD Protection
Texas Instruments Interface - Specialized 7-CHANNEL INTEGRATED ESD SOLUTION 140In Stock
5,000Expected 11/6/2026
Min.: 1
Mult.: 1
: 2,500

- 40 C + 85 C SMD/SMT SSOP-16 ESD Protection
Texas Instruments Interface - Specialized 7-Ch INTEGRATED ESD SOLUTION 1,589In Stock
Min.: 1
Mult.: 1
: 3,000

- 40 C + 85 C SMD/SMT UQFN-16 ESD Protection
NXP Semiconductors Interface - Specialized High-speed CAN/ LIN core system basis chip
25On Order
Min.: 1
Mult.: 1
: 2,000

28 V 4.5 V 76 uA - 40 C + 125 C SMD/SMT HTSSOP-32 ESD Protection
NXP Semiconductors Interface - Specialized High-speed CAN/ LIN core system basis chip Non-Stocked Lead-Time 8 Weeks
Min.: 2,000
Mult.: 2,000
: 2,000

28 V 4.5 V 76 uA - 40 C + 125 C SMD/SMT HTSSOP-32 ESD Protection
NXP Semiconductors Interface - Specialized High-speed CAN/ LIN core system basis chip Non-Stocked Lead-Time 8 Weeks
Min.: 2,000
Mult.: 2,000
: 2,000

28 V 4.5 V 76 uA - 40 C + 125 C SMD/SMT HTSSOP-32 ESD Protection
NXP Semiconductors Interface - Specialized High-speed CAN/ LIN core system basis chip Non-Stocked Lead-Time 8 Weeks
Min.: 2,000
Mult.: 2,000
: 2,000

28 V 4.5 V 76 uA - 40 C + 125 C SMD/SMT HTSSOP-32 ESD Protection
NXP Semiconductors Interface - Specialized High-speed CAN/dual LIN core system basis chip Non-Stocked Lead-Time 8 Weeks
Min.: 2,000
Mult.: 2,000
: 2,000

28 V 4.5 V 77 A - 40 C + 125 C SMD/SMT HTSSOP-32 ESD Protection
NXP Semiconductors Interface - Specialized High-speed CAN/dual LIN core system basis chip Non-Stocked Lead-Time 8 Weeks
Min.: 2,000
Mult.: 2,000
: 2,000

28 V 4.5 V 77 A - 40 C + 125 C SMD/SMT HTSSOP-32 ESD Protection
NXP Semiconductors Interface - Specialized High-speed CAN/dual LIN core system basis chip Non-Stocked Lead-Time 8 Weeks
Min.: 2,000
Mult.: 2,000
: 2,000

28 V 4.5 V 77 A - 40 C + 125 C SMD/SMT HTSSOP-32 ESD Protection
NXP Semiconductors Interface - Specialized High-speed CAN/dual LIN core system basis chip Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1
: 2,000

28 V 4.5 V 77 A - 40 C + 125 C SMD/SMT HTSSOP-32 ESD Protection