THERM-A-GAP® CIP 35 2.5W/m-K Thermal Compound

Parker Chomerics THERM-A-GAP® Cure-in-Place (CIP) 35 Thermal Compound is a two-component dispensable compound with a 2.5W/m-K thermal conductivity. The CIP 35 compound features 55 Shore A hardness and cools electronics without excessive compressive force in sensitive cooling applications. This versatile liquid can be dispensed by hand or robotically and cured into complex geometries to cool multi-height components on a printed circuit board (PCB) without a molded sheet. The series is available in ready-to-use cartridge systems that eliminate the need for weighing, mixing, and degassing. Parker Chomerics THERM-A-GAP CIP 35 Thermal Compound offers a long shelf life with no settling or degradation of the cure.

Resultados: 2
Seleccionar Imagen N.° de pieza
 Fabricante:
Descripción Hoja de datos Disponibilidad Precio: (PEN) Filtre los resultados en la tabla por precio unitario en función de su cantidad.
Cantidad RoHS Modelo ECAD Producto
Tipo
Conductividad térmica
Color
Temperatura de trabajo mínima
Temperatura de trabajo máxima
Régimen de inflamabilidad
Serie
Parker Chomerics Productos de interfaz térmica Thermal Conductive Cure-In-Place Compound, 2-Part, 2.5W/m-K, 45CC Kit
Hoja de datos
15En existencias
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Silicone Compound, 2 Part 2.5W/m-K Green - 55 C + 200 C UL 94 V-0 CIP35
Parker Chomerics Productos de interfaz térmica Thermal Conductive Cure-In-Place Compound, 2-Part, 2.5W/m-K, 200CC Kit
Hoja de datos
12En pedido
Min.: 1
Mult.: 1

CIP35