MIL-HD2 Next-Gen VITA 91 Connectors

Amphenol Aerospace MIL-HD2 Next-Gen VITA 91 Connectors are developed in alignment with the open group Sensor Open Systems Architecture™ (SOSA™) technical standard. These connectors provide a readily available and robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical. The series is designed to achieve 56Gb/s PAM4 data rate requirements with a higher density of 1.8mm pitch. These connectors feature proprietary crosstalk-reducing technologies and show proven EMI and signal integrity advantages. Amphenol MIL-HD2 VITA 91 connectors show improved impedance matching and provide the complete solution to meet the next-gen performance level. These connectors are uniquely designed to meet high-density application requirements. Applications include radar, sensors, switches, integrated processors, surveillance, cyber defense, C5ISR, and low Earth orbit satellites.

Resultados: 2
Seleccionar Imagen N.° de pieza Fabricante: Descripción Hoja de datos Disponibilidad Precio: (PEN) Filtre los resultados en la tabla por precio unitario en función de su cantidad. Cantidad RoHS Modelo ECAD Producto Número de posiciones Número de filas Estilo de terminación Ángulo de montaje Régimen de corriente Velocidad de transmisión de datos máxima Temperatura de trabajo mínima Temperatura de trabajo máxima Revestimiento del contacto Material del contacto Material del alojamiento Serie
Amphenol Aerospace Conectores placa a placa y Mezzanine Module -4pr 8 Column 84En existencias
Min.: 1
Mult.: 1

Connectors 64 Position 8 Row Press Fit Straight 1 A 56 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Board Level
Amphenol Aerospace Conectores placa a placa y Mezzanine MHD2 VITA 91
61Se espera el 23/03/2026
Min.: 1
Mult.: 1

Connectors 64 Position 8 Row Press Fit Straight 1 A 56 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Mil-HD2