TS391 No-Clean Solder Paste

Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.

Resultados: 15
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Descripción Hoja de datos Disponibilidad Precio: (PEN) Filtre los resultados en la tabla por precio unitario en función de su cantidad.
Cantidad RoHS Producto
Tipo
Aleación
Tipo de paquete
Chip Quik Soldadura Paste No-Clean 15g Sn63/Pb37 T4
Hoja de datos
557En existencias
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Soldadura Paste No-Clean 35g Sn63/Pb37 T4
Hoja de datos
151En existencias
324Se espera el 15/06/2026
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Soldadura Paste No-Clean 50g Sn63/Pb37 T4
Hoja de datos
337En existencias
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Soldadura Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4
Hoja de datos
148En existencias
294Se espera el 6/07/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Soldadura Paste NoClean 35g Sn42/Bi57.6/Ag0.4 T4
Hoja de datos
71En existencias
123Se espera el 6/07/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Soldadura Paste NoClean 250g Sn42/Bi57.6/Ag0.4 T4
Hoja de datos
32En existencias
54Se espera el 6/07/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Soldadura Paste No-Clean 50g Sn42/Bi57.6/Ag0.4 T4
Hoja de datos
133En existencias
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Soldadura Paste NoClean 15g T4 Sn96.5/Ag3.0/Cu0.5
Hoja de datos
211En existencias
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Soldadura Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5
Hoja de datos
82En existencias
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Soldadura Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5
Hoja de datos
152En existencias
281Se espera el 5/08/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Soldadura Paste NoClean 50g T4 Sn96.5/Ag3.0/Cu0.5
Hoja de datos
252En existencias
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Soldadura Paste No-Clean 250g Sn63/Pb37 T4
Hoja de datos
69En existencias
117Se espera el 27/07/2026
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Soldadura Paste No-Clean 500g Sn63/Pb37 T4
Hoja de datos
9Se espera el 29/06/2026
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Cartridge
Chip Quik Soldadura Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4
Hoja de datos
Plazo de entrega no en existencias 6 Semanas
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Cartridge
Chip Quik Soldadura Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5
Hoja de datos
N/A
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Cartridge