858-22-006-80-011101

Mill-Max
575-8582200680011101
858-22-006-80-011101

Fabricante:

Descripción:
Alojamientos de cables y cabecera Spring-Loaded Header VertMt Sldrless 6Pi

Hoja de datos:
Modelo ECAD:
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En existencias: 85

Existencias:
85 Se puede enviar inmediatamente
Plazo de entrega de fábrica:
2 Semanas Tiempo estimado de producción de fábrica para cantidades superiores a las que se muestran.
Mínimo: 1   Múltiples: 1
Precio unitario:
S/-.--
Precio ext.:
S/-.--
Est. Tarifa:

Precio (PEN)

Cantidad Precio unitario
Precio ext.
S/60.88 S/60.88
S/50.80 S/508.00
S/50.76 S/1,319.76
S/43.83 S/4,558.32
S/42.08 S/10,940.80
S/39.20 S/19,874.40
S/37.37 S/37,407.37

Atributo del producto Valor de atributo Seleccionar atributo
Mill-Max
Categoría de producto: Alojamientos de cables y cabecera
RoHS:  
Headers
Spring-Loaded
6 Position
4 mm (0.157 in)
1 Row
Through Hole
Solder Pin
Straight
Pin (Male)
Gold
858
Tube
Marca: Mill-Max
Material del contacto: Copper Alloy
País de ensamblaje: Not Available
País de difusión: Not Available
País de origen: US
Régimen de corriente: 9 A
Régimen de inflamabilidad: UL 94 V-0
Color de la carcasa: Black
Material del alojamiento: Thermoplastic (TP)
Resistencia de aislamiento: 10 GOhms
Tipo de producto: Headers & Wire Housings
Cantidad de empaque de fábrica: 13
Subcategoría: Headers & Wire Housings
Productos encontrados:
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Atributos seleccionados: 0

Hoja de datos

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CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Solder Cup Connectors & Terminal Pins

Mill-Max Solder Cup Connectors and Terminal Pins feature double-action spring-loaded pins, spring-loaded headers, receptacles with no tail, and press-fit receptacles for plated through-hole (PTH). These solder cup products include 0.100" (2.54mm) pitch low-profile headers, 0.050" (1.27mm) pitch sockets and spring-loaded connectors, and 0.050" (1.27mm) and 2mm pitch headers with straight and right-angle solder tail options.

858 Rugged Spring-Loaded Connectors

Mill-Max 858 Rugged Spring-Loaded Connectors are available in 2- to 6-position connector variants with a precision-machined piston/base (modular contacts for use on a 4mm grid). These connectors are available in 858-22-00x-10-0x and 858-22-00X-30-0x. The 858-22-00x-10-0x connectors are designed for manual placement into ø0.048±0.003" plated through-holes in the circuit board before soldering; 858-22-00x-30-0x connectors are designed for manual placement onto ø0.100" solder pads. These Pistons offer 0.045" mid-stroke and 0.090" maximum stroke. The 810 SMT connector's gold-plated components offer a 1,000,000 minimum lifecycle. These connectors also include high-temperature thermoplastic insulators suitable for wave and reflow processes.

Target Connectors and Contacts

Mill-Max Target Connectors and Contacts for Spring-Loaded Products provide a convenient mating surface to connect with Mill-Max Spring-Loaded Connectors and Pins. The Target Connectors and Contacts are an ideal solution for applications requiring a conductive extension from the surface of one module up to another.

Spring Loaded Interconnect Headers

Mill-Max Spring Loaded Interconnect Headers provide field-proven performance and reliability in harsh environments when uneven mating surfaces, floating height requirements, and exposure to extreme vibration all challenge the integrity of electrical connections. The connectors are arrays of individual contacts and ensure continuity across a wide variety of length and stroke configurations, including ultra-low profiles.

Spring-Loaded (Pogo Pin) Connectors

Mill-Max Spring-Loaded (Pogo Pin) Connectors provide a reliable electrical connection in the most rigorous environments. These interconnect components are typically used as the base unit (battery/charger) interface for portable equipment such as mobile phones/radios, barcode readers, medical, and test instruments. Mill-Max Spring-Loaded (Pogo Pin) Connectors can also be used as a rugged surface-to-surface connector between circuit boards.

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